Go Back
HSD-102314442
NANO SIM PUSH-PUSH
Housing: Stainless Steel
Terminal: Phosphor Bronze
Plastic: LCP
Operating Temperature：-40∘C±85∘C
Plating: Tin/Nickel/Gold Plated
NANO SIM PUSH-PUS, as many mobile devices become smaller and smaller and require more and more memory, mobile storage devices need to be more compact than ever before, without reducing storage space, and provide multiple types of pop-ups converter and provides polarization to prevent incorrect card insertion
Terminal: Phosphor Bronze
Plastic: LCP
Operating Temperature：-40∘C±85∘C
Plating: Tin/Nickel/Gold Plated
NANO SIM PUSH-PUS, as many mobile devices become smaller and smaller and require more and more memory, mobile storage devices need to be more compact than ever before, without reducing storage space, and provide multiple types of pop-ups converter and provides polarization to prevent incorrect card insertion
More Details
Applications
- An all-purpose universal interface is needed for small devices such as cell phones, tablets, and bracelets.
