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HSD-102313952
MICRO SIM PUSH 1.42H
Housing: Stainless Steel
Terminal: Phosphor Bronze
Plastic: LCP
Operating Temperature：-40∘C±85∘C
Plating: Tin/Nickel/Gold Plated
MICRO SIM PUSH 1.42H, ,As many mobile devices become smaller and smaller and require more memory, mobile storage devices need to be more compact than ever before, without reducing storage space, providing a variety of ejector and provides polarization to prevent incorrect card insertion
Terminal: Phosphor Bronze
Plastic: LCP
Operating Temperature：-40∘C±85∘C
Plating: Tin/Nickel/Gold Plated
MICRO SIM PUSH 1.42H, ,As many mobile devices become smaller and smaller and require more memory, mobile storage devices need to be more compact than ever before, without reducing storage space, providing a variety of ejector and provides polarization to prevent incorrect card insertion
More Details
Applications
- An all-purpose universal interface is needed for small devices such as cell phones, tablets, and bracelets.
